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AFW3000
SPECIFICATIONS
Architecture
PCI/PCI-X
CPU Type
Intel® Xeon™ Processor
CPU L2 Cache
512KB
CPU Voltage
1.1V~1.85V (VRM 9.1 DC-DC Converter)
Front Side Bus
533MHz FSB (E7501)
System Speed
2.2GHz ~ 3.06GHz or higher
CPU External Clock
133MHz (E7501)
DDR Clock Speed
266Mhz (E7501)
Green /APM
APM1.2
Chipset
Intel® E7501 Chipset
E7501: Memory Controller Hub
P64H2: Hub Link to PCI-X
ICH3: I/O Controller Hub
BIOS
Award (4M FWH)
System Memory
Two 184-pin DDR sockets, support only ECC registered
DIMMs (in pairs)
Max 4GB, DDR 266 support
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FEATURES
- Supports Intel® Xeon™ processor
- Intel® E7501 Chipset with P64H2 Hub Link to PCI-X
- 533MHz Front Side Bus
- Two 184-pin DDR sockets, Max 4GB Max
- Two Intel® 82546EB Dual Port Gigabit
Ethernet Controllers, PCI-X 64-bit
- Supports four RJ45 connectors or four Fiber channels
- USB 1.1, ATX P/S, PCI-X slot, MicroPCI connector
LPC I/O
Winbond 83627HF LPC I/O
Battery
Lithium Battery
VGA
None on board, supported via MicroPCI VGA*
LAN
On Board Dual Gigabit LAN
Two Intel® 82546EB Dual port Gigabit Ethernet controllers,
PCI-X 64-bit
Support four RJ45 or four Fiber channel connectors
IDE Connector
Primary IDE channel with 44-pin 2.0mm IDE connector
Secondary IDE channel for Compact Flash Type-1 Socket
USB
Two ports on board, USB 1.1 compliant
Hardware Monitoring
Built in LPC I/O for monitoring voltage, temperature, fan rotation
Power Connector
20-pin ATX power connector
PCI-X Slot
184-pin PCI-X slot (64-bit), 3.3V
MicroPCI Connector
32-bit MicroPCI connector
FDD Connector
26-pin header slim-type connector
Keyboard/Mouse Connector
6-pin header
Parallel Port Connector
2 ports, 13-pin header (2.54mm)
PCB Layer
8 layers
Form Factor
Custom Size
Board Size
29.8cm x 26.64cm
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